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In this paper, we present the experimental and modeling characterization of 3D packages for high power applications using a dedicated stackable test chip. An advanced CMOS test chip with programmable power distribution and a 32×32 array of temperature sensors has been designed, fabricated, stacked and packaged in bare die 3D packages. The package thermal measurements have been used to characterize...
This paper deals with the thermal and electrical modelling and simulation of an automotive high power battery cell. The electrical modelling is implemented for determining the electrical losses. The electrical losses are converted to heat losses and therefore a heat flow in the cell. The thermal modelling is based on a 1D implementation by means of discrete volume elements. The resulting simulation...
The SrTiO3 and Y-doped SrTiO3 polycrystalline sintered bodies were synthesized by the polymerized complex (PC) process and the subsequent hot pressing at 1473 K for 1 h or at 1673 K for 2 h in Ar atmosphere. The X-ray diffraction patterns of the SrTiO3 and Sr0.9Y0.1TiO3 samples synthesized by the PC process and hot pressing at 1473 K showed that these samples were mostly composed of the SrTiO3 single...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
The purpose of this study is to investigate the leakage field from the auxiliary layer to the recording layer in an exchange-coupled multilayered magneto-optical medium. In order to estimate the leakage field, test media, in which the auxiliary layer was deposited on the recording layer with a nonmagnetic layer intervening, were prepared. The leakage field was determined as the difference in the threshold...
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