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Nowadays LEDs (Light Emitting Diodes) are widely used in many fields. As the fourth generation of lighting sources, LEDs have the advantages of long lifetime, power saving and environment-friendly. In this paper, the thermal variation characteristic of some parameters for two high-power LEDs packaging modules, such as forward voltage, luminous flux, CCT and luminous efficiency, were analyzed experimentally...
The design and fabrication of a novel 2-D wind sensor as well as the interface circuits and test results were presented in this paper. A novel constant temperature difference (CTD) mode control circuits with thermal feedback was proposed, and full bridge circuits were used for wind measurement. It was fabricated on the ceramic substrate, and direct chip attach (DCA) packaged to the substrate. The...
A new thermal model based on Fourier series expansion method has been presented for dynamic thermal analysis on power devices. The thermal model based on the Fourier series method has been programmed in MATLAB SIMULINK and integrated with a physics-based electrical model previously reported. The model was verified for accuracy using a two-dimensional Fourier model and a two-dimensional finite difference...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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