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3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. The complexity of the interconnection structures, combined with the reduced thermal spreading in the thinned dies and the poorly thermally conductive adhesives complicate the thermal behavior of a stacked die structure. The same dissipation will lead to higher temperatures and a...
Surface mounted components are considered fine pitch if lead pitches are equal or lower than 0.65 mm (25 mils). Fine pitch Ball Grid Array (BGA) Integrated Circuits (IC-s) require special considerations for design, assembly and failure analysis. Design for Manufacturing (DfM) is a key aspect in the PCB design process. As for soldering, Vapor Phase Soldering (VPS) is an emerging reflow method for fine...
A study was initiated in order to thermally quantify the characteristics of package-on-package (POP), which has been deployed in multiple mobile devices in order to reduce board area and subsequently mobile device size. In most POP scenarios, the memory package is stacked on top of a baseband or application processor and reflowed together. Thermal simulations were conducted for a POP package configuration...
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