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The fabrication of both n and p-type Si MOS capacitors using high k dielectric as insulator deposited by atomic layer deposition technique is presented. The interface obtained between the high k dielectric and the semiconductor substrate, critical for stability and feasibility of the experimental devices, is analyzed using both numerical calculation of the ideal capacitance — voltage (C-V) characteristics...
GaAs MOS capacitors with ZrTiON high-${k}$ gate dielectric and ZrLaON or ZrON as interfacial passivation layer (IPL) are fabricated, and their electrical properties are investigated. As compared with a control sample without IPL, improved interfacial quality and electrical properties are obtained for both samples, with the ZrTiON/ZrLaON/GaAs device, exhibiting the lowest interface-state density...
This work demonstrates high quality Ge/GeO2 interfaces fabricated by O2 RTA that are degraded by a good quality SiO2 layer deposited by ALD. However, neither O3 and H2O precursors commonly used during subsequent high-k ALDs nor Si precursor AP-LTO-330 do not degrade the interface. Thus Dit increase after SiO2 deposition is likely due to intermixing. Therefore, the effect of subsequent ALDs on the...
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