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As IC performance increases, many technical challenges appear in the areas of current-carrying capacities, thermal management, I/O density, and thermal-mechanical reliability. To address these problems, the use of aligned carbon nanotubes (CNTs) has been proposed in IC packaging for electrical interconnect and thermal interface materials (TIMs). The theoretically superior electrical, thermal, and...
Several wafer bond technologies like direct and anodic bonding without intermediate layer or thermo-compression wafer bonding with intermediate layers like low melting frit glasses, eutectic materials or polymers were developed during the last years and are nowadays extensively used in industrial applications. The paper will describe some important aspects of new Ti-Si and Laser assisted transmission...
The improvement of electronic interconnection systems reliability after implementation of EU Directive RoHS is currently one of the main goals in development of electronic equipment assembly. In fact, the reliability of equipment is created mainly during design and production stage. But these phases should be proceeded by research phase. During this phase the ecologically friendly materials and ecologically...
This paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-diameter were used. Two different types of conductive particles were characterized with respect to their...
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