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NEMI recommended Sn3.9Ag0.6Cu to replace the eutectic SnPb solder, but solder joints of this alloy have poor performance in reliability tests of electronic packages, especially the board level drop test. In this paper, the effect of Cu content in solder is studied on the interfacial reliability of SnAgCu solder joints on the Ni/Au plated pads. After preconditioning (three reflows post package assembly),...
In this work, Ag micro-particles content in the range between 0-4.0 wt.% with Sn-Zn eutectic system, were examined in order to understand the effect of Ag addition on the microstructural and mechanical properties as well as the thermal behavior of the composite solders. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
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