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NEMI recommended Sn3.9Ag0.6Cu to replace the eutectic SnPb solder, but solder joints of this alloy have poor performance in reliability tests of electronic packages, especially the board level drop test. In this paper, the effect of Cu content in solder is studied on the interfacial reliability of SnAgCu solder joints on the Ni/Au plated pads. After preconditioning (three reflows post package assembly),...
This study utilized out high speed lap-shear tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150??C and 170??C) were also tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the lap-shear...
The work presented in this paper focuses on the role of 3 wt.% Bi in the base Sn-9%Zn solder on the shear strengths and the interfacial reactions with Au/Ni/Cu pad metallization in ball grid array (BGA) applications. Sn-Zn based Pb-free solder alloys were kept in molten condition (240degC) on the Au/electrolytic Ni/Cu bond pads for different time periods ranging from 1 minute to 60 minutes. Cross-sectional...
In this work, Ag micro-particles content in the range between 0-4.0 wt.% with Sn-Zn eutectic system, were examined in order to understand the effect of Ag addition on the microstructural and mechanical properties as well as the thermal behavior of the composite solders. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad...
In this investigation, normal and high speed ball shear test were used to evaluate the solder joint performance. Solder residual fracture mode is always being found in normal ball shear for low strain rate. The strength of solder balls are directly associated with their mechanical property in normal ball shear test. High speed ball shear provide a easier way to judge the solder joint performance at...
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