The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This article describes the sixteen most common metals: lithium; potassium; magnesium; barium; zinc; titanium; iron; nickel; copper; silver; tungsten; gold; aluminium; tin; lead; and uranium.
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones. However, the final stack height from the top to the bottom package for these structures is higher than that of the current stacked die packages. To reduce the height of the package, a flip chip technology is used. Since the logic chips of mobile applications use a pad pitch...
The electronics industry has successfully transitioned to lead free soldering for computer and consumer products while in the automotive industry due to the very high reliability requirements this step is still in an ongoing process. In order to ensure or even to enhance the reliability of electronics the improvement of lead free solder joints based on Sn-Ag-Cu (SAC) solder has been the focus of many...
Low resistance Ti/Al/Ni/Au Ohmic contact to (NH4)2Sx treated n-type GaN has been studied in the temperature range from 25??C to 600??C It is found that the specific contact resistivity ??c of the sample treated with (NH4)2Sx solution for 5 min at 90??C decreases with increasing measuring temperature, while the ??c of the sample treated with (NH4)2Sx solution for 25 min at 90??C increases with increasing...
We have used phenomenological models based on statistical mechanics to study the bulk and surface properties of Au–Sn, Al–Mg, and Mg–Tl binary liquid alloys. Our study reveals that the three alloys are weakly ordered systems with the most stable intermetallic complexes at temperatures of 823K, 1073K and 923K been AuSn, Al 3 Mg 2 and Mg 4 Tl, respectively. An analysis of Warren–Cowley...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.