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High gold prices have led to renewed interest in replacing gold with copper in existing packages and new packages in order to save costs. Although reliability is often cited as a reason for using copper, the main driving force for its use is undoubtedly cost. Perceptions that copper wire is more reliable are based on the notion that the intermetallics grow more slowly and that thinner intermetallics...
Ultra-fine pitch Au wire has become inevitable in the electronic packaging industry due to decreasing electronic package dimension and increasing cost of gold. However, fine pitch Au wire with diameter less than 0.5 mil. (12 ??m), bonded on Al pad, showed low inter-metallic coverage, and it caused distinctive interfacial failures: the oxidation of Au4Al and overgrowth of inter-metallic compound (IMC)...
To reduce material cost of Au bonding wire, Au-Ag alloy wire had been tried to use in electronic device, in alternative for Au wire. Nevertheless, Au-Ag alloy wire had not been applied to device due to failure problem during high humidity reliability test, like PCT(pressure cooker test) for a while. Recently, as the technology adding Pd element to conventional Au-Ag was developed, corrosive failure...
A novel three-dimensional packaging method for Al-metalized SiC power devices has been developed by means of Au stud bumping technology and a subsequent vacuum reflow soldering process with Au-20Sn solder paste. Al-metalized electrodes of a SiC power chip can be robustly assembled to a direct bonded copper (DBC) substrate with this method. The bump shear strength of a Au stud bump on an Al electrode...
To extend the qualification domain to the biggest package size in the automotive environment at high temperature, it is necessary to improve the Au-Al bond reliability. Thus, the improvement provided by addition of palladium as alloying elements to Au bonding wires is evaluated. In this study, the use of Au-1 wt%Pd instead of pure Au is investigated; samples are aged at 175 and 200??C. In the case...
The electrical characterization of fine-pitch compliant Au bumps is investigated in this study. Compliant Au bumps of 20 microns pitch were fabricated on a glass substrate for chip-on-glass application. Kelvin probes are fabricated and employed to measure the bump resistance. The resistance ranges from 1.0 to 4.5 ohms, depending on process parameters. Current-carrying capability for these bumps is...
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