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Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with finite-element (FE) simulations. The reliability tests were composed of the thermal shock test, the local thermal cycling test (resistors embedded in the board around the package), and the power cycling test (heat generation in the die). A 3-D board-level...
This work models and simulates the electrothermal properties of GaAs pHEMT based Monolithic Microwave Integrated Circuits (MMIC). The temperature increase of each component due to the self heating of the power devices in the packages was simulated coupled with the static electromagnetic analysis. A linear RC thermal macromodel was developed for the die, and the temperatures are solved by using nodal...
A thermal model is presented that follows from the heat conduction equation and is exact under the conditions that the mass density, the specific heat and the thermal conductivity in the set-up do not depend on temperature and that the individual thermal contact areas of the models have uniform temperature distribution. The network models allow for the determination of both: the transient temperatures...
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