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Consumer electronic products are evolving toward smaller size and higher efficiency. 3D IC packaging has smaller form factor and lower signal delay compared with conventional packaging. Thus, it has been widely used in mobile electronic devices. Mobile electronic device is prone to being dropped during operation. Hence, the drop reliability of electronic packaging is an important issue in 3D ICs....
This study assesses the reliability life of 3D chip stacking packaging developed by the Industrial Technology Research Institute (ITRI). The simulation results show that the trends of stress of through silicon via (TSV) structures with different chip stacking numbers are nearly constant during thermal stress analysis. Therefore, the simplified two-layer chip stacking model is adopted to analyze the...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
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