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We report here preliminary results on a new Cu-cored flip chip structure combining C4NP (Controlled Collapse Chip Connect New Process) with Cu spheres for high density interconnections. C4NP is a new wafer bumping technology developed by IBM in which molten solder is injected into a mold and then transferred to the UBM (Under Bump Metallurgy) pads on the wafer. This simple and parallel process has...
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