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The application of copper wire coated with Palladium is a solution to prevent copper oxidation during the bonding process. This is true in the Second Bond but may not be the situation when it comes to First Bond. This is because during the Free Air Ball (FAB) formation, the Pd coated Cu wire is re-melted and the Pd distribution on the FAB is depending on various factors. For FAB formation, the simplest...
The last three years have seen an aggressive implementation of fine-pitch copper wire bonding in face of ever-increasing gold prices. Numerous technical hurdles associated with copper wire bonding have mostly been overcome. However, achieving process robustness equivalent to gold wire bonding is still challenging and requires enhanced manufacturing control procedures. Although the 2nd bond in copper...
Because of its high thermal conductivity, great electrical property and low cost, copper wire is considered to replace the conventional gold wire and is becoming widely used in IC assembly processes recent years. Compared to gold wire, copper wires has higher thermal conductivity, lower electrical resistivity, and higher pull strength allowing for a reduced wire diameter. Besides, copper wire is much...
Ultra-fine pitch Au wire has become inevitable in the electronic packaging industry due to decreasing electronic package dimension and increasing cost of gold. However, fine pitch Au wire with diameter less than 0.5 mil. (12 ??m), bonded on Al pad, showed low inter-metallic coverage, and it caused distinctive interfacial failures: the oxidation of Au4Al and overgrowth of inter-metallic compound (IMC)...
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