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This investigation has achieved semi-uniform coatings of single-walled carbon nanotubes (SWNT) onto copper substrates by electrodeposition from a metallic plating bath as well as electrophoretic deposition. Furthermore, SWNT mat was used as an electrode in which metallic ions were electrodeposited. CVD-produced SWNT were functionalized via agitation concentrated sulfuric acid/nitric acid. FTIR studies...
Conventional approach of copper interconnects has become a major bottleneck for VLSI system performance due to larger delay and increased susceptibility to noise in deep sub-micrometer (DSM) technology. Bundles of single-walled carbon nanotubes (SWCNT) have been proposed as a possible replacement for copper interconnect due to their outstanding conductivity and current-carrying capabilities. This...
This paper presents a comprehensive study of the applicability of single-walled carbon nanotubes (SWCNTs) as interconnects in nanoscale integrated circuits. A detailed analysis of SWCNT interconnect resistance (considering its dependence on all physical parameters, as well as factors affecting the contact resistance), the first full 3-D capacitance simulations of SWCNT bundles for realistic very large...
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