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Archives of Civil and Mechanical Engineering > 2022 > Vol. 22, no. 1 > art. no. e9, 2022
Materials Letters > 2017 > 206 > C > 201-204
Journal of Electroanalytical Chemistry > 2013 > 695 > Complete > 38-46
2008 10th Electronics Packaging Technology Conference > 1054 - 1059