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In this study, Ag/NiNiP-plated Cu leadframes from two different processes are compared in terms of NiNiP surface morphology, composition of NiP layer, grain structures of Ni and NiP plated layers, and impurities in the interface of Ni/NiP plated layers. Their impacts were assessed after solder plating and baking. Scanning electron microscopy (SEM) shows that the grain size of Leadframe A (from Process...
The effects of the rare earth Ce element on melting temperature, wettability of Sn-0.3Ag-0.7Cu low-Ag lead-free solder and the intermetallic compounds morphologies of Sn-0.3Ag-0.7Cu-XCe/Cu were investigated. The addition of the Ce element has an unconspicuous effect on decreasing the melting temperature of Sn-0.3Ag-0.7Cu solder. The results indicate that the addition of Ce element increases the wettability...
Highly ordered porous Ni3P film was successfully prepared by electrodeposition through self-assembled monodisperse polystyrene sphere template on copper substrate. The microstructure and morphology of the Ni3P film were characterized by X-ray diffraction (XRD) and field emission scanning electron microscopy (SEM). The structure of the as-prepared Ni3P film is tetragonal with space group of I4 (a =...
Nano Ga-doped ZnO(GZO) thin films with different Ga doping concentration (1, 3, 5, 7at%) were deposited on glass substrate by RF magnetron sputtering. The influence of Ga doping concentration on the microstructure, morphology and thermoelectric properties of GZO films was investigated. It is found that all the films are polycrystalline with C-axis preferred orientation. the crystal size are 22, 15,...
It is found that the morphologies and orientations of Cu6Sn5 can be well controlled through designing orientations of Cu single crystal substrates. On (001) and (111) Cu single crystals, Cu6Sn5 grains display regular prism-type morphology and align either along two perpendicular directions or along three directions having an angle of 60deg between each other. By electron backscatter diffraction (EBSD)...
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