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This paper discusses the Restriction of Hazardous Substances (RoHS) directive as it relates to active implantable medical devices (AIMD). AIMD have remained out of the scope of RoHS at this time. The changes to large volume commercial electronics targeted by RoHS have resulted in changes to component sourcing that have impacted AIMD components in the availability of non-RoHS legacy components and...
In February, 2003, the European Union adopted the RoHS Directive 2002/95/EC (Restriction on Hazardous Substances). The directive sets limits on the concentration of six environmentally toxic substances in various electronic products and electrical equipment. These six substances include Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent Chromium (Cr+6), Polybrominated biphenyles (PBB) and Polybrominated...
As the industry moves towards meeting the RoHS-6 requirements of eliminating the use of Pb in products, some BGA packages have become available only with Pb-free balls or available with Sn/Pb balls but only at a high cost premium. In many cases, companies are not yet ready to convert existing products to Pb-free. For this reason, the feasibility of using a backwards compatible (BGA balls with Pb-free...
Due to its ease of application pure tin has been selected by the industry as the main alternative to solderable tin/lead deposits following RoHS legislature. After several years of industry experience several issues have developed which are due to the corrosion of the top layer during storage. The most serious of effects has been the growth of whiskers during heat/humidity (55degC/85% r.h.) storage...
The subject matter we consider in this paper are the significant reliability uncertainties around lead-free solder and how to best consider these risks and mitigate them so as not to take a hit in the area of reliability during the lead-free transition. Like the rest of the electronics industry, your products will transition to restriction of hazardous substances (RoHS) compliance. This includes the...
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