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Warpage, high stress in dies and solder joints are introduced in assembly process of a package-on-package component. In this paper, a finite element approach is proposed to predict the warpages and stresses during the full assembly process. By the techniques of element die and birth as well as restart method, the approach is able to transfer the stress and warpage in one process to the next so that...
A novel stacked converter construction technology, Power Sandwich that lends itself towards automation and high power densities has been proposed. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height are stacked between planar substrates in a few stack layers. Double-sided x-dim components are soldered to both top and bottom sides. The concept of Power Sandwich...
An array of accelerated temperature cycling (ATC) finite element (FE) simulations using ANSYStrade, and drop-impact finite element simulations using LS DYNAtrade, are used to find the optimum elastic modulus and coefficient of thermal expansion (CTE) for a stacked chip scale package. For the ATC simulations, Anand's constitutive model with properties for Sn96.5Ag3.0Cu0.5 (SAC305) and tin-lead eutectic...
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