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Optocouplers are devices that block light in one direction but allow light to pass in the opposite direction which are widely used in long distance signal transmission, pulse amplifying circuits and telecommunication equipment. The unique construction, materials, and interfaces in optocouplers that make their failure modes and mechanisms different. This paper presents a definite and comprehensive...
Performance reliability and degradation of 190 mono-crystalline PV modules from 9 different manufactures after 16 years in a power plant with fixed tilt configuration under composite climate of India have been evaluated. The dominant failure mode of PV module in the climate zone is found by using a statistical reliability tool, FMECA. Main objective of this study is to do RPN analysis of 25 different...
In plastic power devices, the interfaces of Cu/EMC are most likely to delaminate under thermal loading, especially when moisture diffuses into the interface through EMC. In this work, the bare die samples were fabricated in standard commercial process. Shear test of Cu/EMC interface was designed to measure the strength of the interface with different lead-frame oxidation and moisture absorption time...
Stacked die package is a key technique to meet the requirements of smaller size and higher density of electronic products. Moisture plays an important role in the reliability of electronic devices, especially with high temperature, in which the major failures are from corrosion, delamination and crack. The delamination and crack make the device to be easily weak and sensitive to external environment...
Accurate assessment of the quality of concrete bridge decks and identification of corrosion induced delamination leads to economic management of bridge decks. It has been demonstrated that ground penetrating radar (GPR) can be successfully used for such purposes. The growing demand on GPR has brought into the challenge of developing automatic processes necessary to produce a final accurate interpretation...
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