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The electromigration (EM) of a solder ball under high-current stressing causes it damage and reduces its service life. Previous studies suggest that the EM life of solder can be improved by properly selecting the solder stress property (compressive or tensile) at the corners where the electron current enters and exits, but complete and relevant research on this proposition is absent. In this paper,...
It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure...
Local interconnect (LI) as a contact scheme impacts significant the behavior of protection devices under Electro Static Discharge (ESD) stress. The narrow LI reduces the ESD robustness. At the same time, the on-resistance increases. This makes ESD protection design in future technology nodes more challenging, as the ESD design windows continuously shrinks.
The relationship between an electrical breakdown and a space charge accumulation in low-density polyethylene (LDPE) and cross-linked polyethylene (XLPE) was investigated under high dc stress using the pulsed electro-acoustic (PEA) measurement system with a circuit for an external current measurement. It has been found that the space charge accumulation strongly affects the breakdown characteristics...
Sine waveform AC skin effect of lead-free Sn95.5%Ag4.0%Cu0.5 (SAC405) solder joints was investigated experimentally. It was found that 1 MHz is critical frequency above which skin effect becomes essential for lead-free solder joints. Since our concerned frequency in this study is far below 1 MHz, skin effect is not ignored in computer simulations. Sine waveform alternating current (AC) was used to...
The in-situ measurement of the stress evolution at the anode and cathode interfaces of the Cu/3.0Ag0.5Cu/Cu solder joints with current density of 4 × 103A/cm2 at room temperature by X-ray diffraction technique was investigated. The experimental results showed that the stress evolution at the interfaces was a very complicated process during current stressing, which owed to many influencing factors...
The ever increasing scaling down of IC leads to ever more current density in interconnects. As a consequence, electromigration (EM) becomes a concern in interconnect reliability. In order to face this problem and allow more current density in design, one can take advantage of the Blech effect. Many investigations have proposed extraction methods, behaviors or values for the threshold jLc product but...
In-situ observation of stress in Al interconnects under electromigration and thermal effect by using the synchrotron radiation x-ray diffraction. The test temperature was controlled by changing the current density of W (self-heating structure). The EM-induced stress was also investigated with current densities from 3times105A/cm2 to 4times106A/cm2. The conclusion agreed well with the simulation results.
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
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