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Technology scaling has led to severe electromigration degradation for advanced interconnects. Taking full advantage of the Blech effect benefit has become more and more important for circuit design to overcome this EM performance degradation. Due to the wide range of circuit design layout variations, understanding the EM characteristics of the short lines closely related to the real circuit and chip...
The ever increasing scaling down of IC leads to ever more current density in interconnects. As a consequence, electromigration (EM) becomes a concern in interconnect reliability. In order to face this problem and allow more current density in design, one can take advantage of the Blech effect. Many investigations have proposed extraction methods, behaviors or values for the threshold jLc product but...
We have conducted electromigration tests on Cu/low-k standard short-line structures as well as those with varying numbers of reservoirs. We found that the presence and number of reservoirs as well as current direction relative to the reservoir led to markedly different electromigration performance in terms of lifetime and distribution shape. That is, in the case of a reservoir by the anode (or electron...
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