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This paper reports on the reliability of ultrasonically wedge-bonded 99.99% (4N) and 99.999% (5N) pure aluminum wires under different passive thermal cycling ranges, namely, -40°C to 190°C, -60°C to 170°C, -35°C to 145 °C, and -55°C to 125°C. The rate of bond strength degradation during cycling was found to be more rapid in the wire bonds subjected to lower peak temperatures (Tjmax) and lower temperature...
This paper presents findings evidencing that electromigration(EM) imparts significant influence on the kinetics of contact failure of Au wire bonded to an Al pad. Contact resistance between Au wire and Al pad at moderately accelerated test conditions (T=150-175degC; j=5times104A/cm2) revealed that the failure rate depends highly on the direction of electron flow across the contact: electron flow from...
Heavy aluminum wire bonding is of great interest as a first level packaging technology for automotive and power electronic devices. The related mechanical and thermo-mechanical cyclic loading conditions require an adequate consideration of reliability aspects and lifetime estimations based on in-depth knowledge of material properties, involving an understanding of the correlation between mechanical...
A Al/Al stacked multilayered interconnection that can suppress both stress-induced and electromigration failures without barrier metal was developed. Stress-induced failures are almost completely suppressed and electromigration lifetime is improved more than four times. The higher reliability mechanism is explained in terms of graphed results of the microstructure and mechanical properties
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