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The DARPA Diverse Accessible Heterogeneous Integration (DAHI) program is developing transistor-scale heterogeneous integration processes to intimately combine advanced compound semiconductor (CS) devices, as well as other emerging materials and devices, with high-density silicon CMOS technology. This technology is currently enabling RF/mixed signal circuits with revolutionary performance. For example,...
This paper highlights some of the key challenges for the quality and reliability of semiconductor components based on field return data and root cause Pareto analysis. Some key learnings are discussed. The paper also discusses the topic of the role of organizations, its tasks and infrastructure necessary to achieve the required IC component quality and reliability. Specific examples are discussed...
Semiconductor manufacturing process is becoming more and more complex while manufacturing technology is developed to deep sub-micron region. Therefore, more and more company is turning to capital-light and focusing on core business. Foundry is the player usually providing silicon manufacturing service to customers. According to customer's capital-light strategy, foundries are required to provide more...
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