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The demand for high-density electronic applications is growing. This work develops a novel chip-on-flex (COF) package with sidewall-insulated Au-coated polyimide (PI) compliant-bumps. A double-layer anisotropic conductive adhesive (ACA) material that meets the assembly requirement is adopted for the ultra-fine pitch interconnects. A process for manufacturing 20- μm pitch compliant-bumps is proposed...
The need for flexible interconnects in advanced applications in consumer electronic products is increasing rapidly. The reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects formed using anisotropic conductive adhesive (ACA) are thus investigated. Two films of ACA materials, namely ACA-P and ACA-F, are assembled at different bonding temperatures to study the effect of temperature...
In this study, three kinds of nonconductive film (NCF) adhesives named as NCF I-NCF II and NCF III, were applied to COF package with compliant-bump. Firstly, to investigate bonding temperature effects, the curing rate of the NCFs and strength of interconnection under different bonding temperatures (150??C ~ 230??C) were evaluated using differential scanning calorimeter (DSC) test and a 90 degree peeling...
The reliability of automotive electronics depends a great deal on solder joints. After the WEEE and RoHS came into effect the new focus became lead-free solder pastes such as SnAg or SnAgCu (SAC). One approach to improve the thermal fatigue properties of these alloys is to add a third or fourth alloying element SAC + X. Until now, this was always done by metallurgical alloying, requiring special apparatuses,...
To improve mean-life and reliability of power cable, we have investigated specific heat and thermal conductivity of XLPE insulator and semiconducting materials in 154 kV XLPE cable. Specimens were respectively made of sheet form with EVA, EEA and EBA with carbon black 30 wt%, and the other was made of sheet form by cutting XLPE insulator in certain 154 kV power cable. Specific heat and thermal conductivity...
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