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A hierarchically structured Cu-Ni-P film fabricated via one-step route of electroless plating is reported. The morphology of deposits can be controlled by adjusting the additive in electrolyte. Due to the synergistic crystalline modification of polyethylene glycol (PEG), Janus Green B (JGB) and Cl−, the as-prepared Cu-Ni-P film exhibits pine-like architecture, about 2 µm in height and 1.5µm in root...
In the process of orthodontic treatment, in order to make patients adorn appropriate brackets fast and accurately, this paper proposes a new modeling method of customized brackets and individualized trays. First of all, as the straight-wire can smoothly pass through all bracket slots after orthodontic treatment, bracket bodies in the database are positioned to the tooth surfaces automatically. Then...
A novel low temperature wafer-level Cu-Cu bonding method using Ag nanoparticles (NP) was proposed and realized in this paper. A bonding structure consisted of Cu bonding pads, TiW barrier/adhesive layer was firstly fabricated on the silicon wafer. Ag NPs were then deposited by physical vapor deposition (PVD) on Cu pads. The morphology of Ag NPs annealed at different temperature was studied. Bonding...
Three-dimensional integration is an emerging and promising architecture for system-level integration towards higher performance, smaller form factor, lower cost and more functionality. In this paper, a novel low temperature Cu nanorod/Sn/Cu nanorod solid-state-diffusion bonding approach for 3D integration was proposed and investigated. Cu nanorods were deposited on the electroplated Cu surface by...
Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing...
In order to lower Cu-Cu bonding temperature and shorten bonding time applied for 3D integration, nanostructure has been introduced on bonding Cu surface. However, few studies have been reported on Nano Particles (NPs) formation by film deposition process such as pulsed laser deposition (PLD), which would be compatible with CMOS process. In this work Ag nanostructure containing strings of NPs was formed...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
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