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This study investigates the effect of alloying additives on the solidification behavior and microstructural characteristics from a metallurgical perspective. Results show that alloying of Mn and Ti resulted in dramatically reduced undercooling coarse eutectic structure and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Those thermal and microstructural changes...
The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper...
In addition to a reduced Ag content, it has been demonstrated that significant improvement of drop test performance of Sn-Ag-Cu solder joints can be achieved by alloying with Mn and Ti. This study aims to investigate the effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys, as well as mechanical properties and thus to explain how the alloying elements...
In this paper, the microstructures of the eutectic and hyper-eutectic Al–Ge alloy under different pressures are observed by using OM and SEM for the analysis of the effects of pressure on eutectic structure in metallic alloys. It can be found that the eutectic microstructure of the Al–53 at.% Ge alloy was obviously refined with pressure increasing from 4.0 GPa to 5.0 GPa. The sibebranched eutectic...
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