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The reliability of high rock-fill dam slope is a complex systematic reliability analysis, which is one of the core and difficult technological problems in dam design. Based on the deterministic finite element method, the system reliability analysis method of high rock-fill dam slope stability using nonlinear indexes is proposed here by integrating strength reduction method, response surface method,...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
Reliability of microfluidic designs is an extremely important issue that defines the range of applicability of micro-devices. The reliability design of micro-channels presents new complications that require extensions of today's method to incorporate reliable prediction methodologies. In this paper, using the improved direct simulation Monte Carlo, a prediction method was proposed for the reliability...
Miniaturisation of electronic devices and the RoHS directive have made the use of solder joints challenging. Thus, new methods for attachment of chips have been developed, such as adhesive attachments. Moisture is the principal cause for failures in these attachments. The effects of moisture to non-conductive adhesive attachments were studied by modeling with finite element method and by environmental...
The interface crack caused by moisture absorption is a main reason for the failure of plastic packaging electronic devices. According to the failure of interface cracks in QFN plastic packaging devices caused by hygro-thermal environment, the paper combining with finite element method (FEM), carried on the research by moisture absorption experiment, lead-free reflow soldering experiment, high temperature...
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