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IEEE Microwave and Wireless Components Letters > 2017 > 27 > 12 > 1053 - 1055
IEEE Electron Device Letters > 2017 > 38 > 10 > 1359 - 1362
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1702 - 1712
IEEE Transactions on Circuits and Systems I: Regular Papers > 2017 > 64 > 9 > 2624 - 2637
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2017 > 36 > 9 > 1497 - 1510
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 307 - 315
IEEE Transactions on Power Electronics > 2017 > 32 > 1 > 363 - 377
IEEE Transactions on Computers > 2017 > 66 > 1 > 38 - 44
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 12 > 3468 - 3476
IEEE Transactions on Circuits and Systems I: Regular Papers > 2016 > 63 > 11 > 2022 - 2035
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 10 > 1513 - 1521
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 8 > 1226 - 1232
IEEE Transactions on Vehicular Technology > 2016 > 65 > 6 > 4393 - 4400
IEEE Transactions on Vehicular Technology > 2016 > 65 > 6 > 4512 - 4522
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2510 - 2516
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2503 - 2509
IEEE Transactions on Industrial Electronics > 2016 > 63 > 3 > 1574 - 1585
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 2 > 544 - 554
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 2 > 192 - 199
IEEE Electromagnetic Compatibility Magazine > 2016 > 5 > 3 > 52 - 60