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IEEE Transactions on Electromagnetic Compatibility > 2018 > 60 > 1 > 77 - 85
IEEE Transactions on Electron Devices > 2017 > 64 > 12 > 4928 - 4936
IEEE Electron Device Letters > 2017 > 38 > 12 > 1767 - 1770
IEEE Transactions on Microwave Theory and Techniques > 2017 > 65 > 12-1 > 4794 - 4801
IEEE Transactions on Nanotechnology > 2017 > 16 > 6 > 891 - 900
IEEE Transactions on Nanotechnology > 2017 > 16 > 6 > 901 - 908
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1702 - 1712
IEEE Transactions on Circuits and Systems II: Express Briefs > 2017 > 64 > 9 > 1067 - 1071
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 381 - 398
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 6 > 1831 - 1841
IEEE Latin America Transactions > 2017 > 15 > 5 > 813 - 818
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 2-1 > 411 - 419
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2017 > 36 > 4 > 628 - 640
IEEE Transactions on Electron Devices > 2017 > 64 > 3 > 1140 - 1145
IEEE Transactions on Microwave Theory and Techniques > 2017 > 65 > 3 > 684 - 692
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 2 > 769 - 773
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 2 > 269 - 275
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 1 > 217 - 227
IEEE Circuits and Systems Magazine > 2017 > 17 > 2 > 47 - 62