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The method of the split cylinder resonator cavity (SCR) is used to characterize accurately and simultaneously in one temperature cycle, dimensional and electrical characteristics of the cavity and the electromagnetic properties of a dielectric material. To do this several modes are used, some to control the cavity and others to control the sample.
Various lasers and light sources on Si via heterogeneous integration of Si/III–V have been reported based on direct growth on Si [1] or wafer bonding technology [2–4]. We reported earlier optically-pumped Si membrane-reflector vertical-cavity surface-emitting lasers (MRVCSELs) fabricated by low-temperature membrane transfer printing processes [5, 6]. Here we report electrically-pumped devices based...
A new coaxial-to-stripline transition based on low temperature co-fired ceramic (LTCC) is proposed and experimentally verified. An additional multilayer dielectric cavity is embedded in the LTCC substrate to improve the impedance and field matching and therefore achieve a wide bandwidth. The measurement results for a back-to-back structure show an a return loss better than 10 dB up to 67GHz.
This paper describes the development and test results of a flight qualified, hermetic I/Q modulator Multi-Chip Module (MCM) with X-band input and Ka-band output for either Tracking and Data Relay Satellite System (TDRSS) or Deep Space Network (DSN) high data rate communications applications. The module is 0.9" wide by 1.7" long without the attachable coaxial connector. It draws <;500...
In this paper, a two-pole cavity resonator filter intended for UAV data-link at Ku-band is demonstrated. The design of the filter realised with LTCC integrated cavity resonators is described and validated by good agreement between specifications and measurements. The unloaded Q-factor of the proposed substrate integrated cavity resonator is assessed and the influence of the different lossy mechanisms...
Heat dissipation is becoming a key issue in designing packages due to growing power densities associated with IC downscaling and the introduction of new semiconductor technologies (e.g. AlGaN). Additionally, FlipChip assembly is being favoured due to small form factor and reduced interconnect parasitics which can be essential for RF and microwave applications. Compared to chip and wire technology...
This paper presents new experimental and numerical methods to characterize the transfer overmolding of substrates with epoxy polymer. We investigated Multi Chip Modules on ceramic panels as well as on printed circuit boards encapsulated by a MAP-type molding process. Experiments show that the polymer flow during the overmolding process depends significantly on the mold height: While standard MAP-type...
This study deals with analyses of PTC (positive temperature coefficient) thick film resistor elements applied in LTCC (low temperature co-fired ceramics) technology. This study concerns the characterization of the electrical performance of PTC-elements placed in a different arrangement on a LTCC-multilayer substrate. Resistors are built-up on LTCC ceramic substrates and sintered in different configurations...
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