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Through Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs). The detection of defective TSVs in the earliest process step is of major concern. Hence, testing TSVs is usually done at different stages of the fabrication process. In this context, this work proposes a simple pre-bond BIST architecture to improve the detection of hard and weak defects.
The convergence and miniaturization of the consumer electronic products such as cell phones and digital cameras has led to the vertical integration of packages i.e., 3-D packaging. 3-D chip stacking is emerging as a powerful tool that satisfies such Integrated Circuit (IC) package requirements. 3-D technology is the trend for future electronics, especially hand-held, hence, making it an important...
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