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An and model was used to establish the constitutive equation of SnAgCu solder, the stress-strain response of soldered joints was analyzed by finite element code. Results indicated that the stress concentrates on the sharp corner of interior part of outermost soldered joint, where is the weakest position at which cracks initiation take place easily and lead to failure owing to thermal fatigue finally...
As a consequence of increasing functional density and miniaturization in microelectronics new low-k and ultra-low-k materials are going to be increasingly used in Back-end of line (BEoL) layers of advanced CMOS technologies. These ongoing trends cause novel challenges for reliability analysis and prediction of relevant electronics assemblies. The optimization of fracture and fatigue resistance of...
Thin film 0-level or wafer-level MEMS packages exhibit relatively low flexural strength and yet they are required to reliably protect the enclosed MEMS devices under extreme processing and operational conditions. In this paper, we present a thermomechanical study of porous alumina-based thin film MEMS packages by making use of finite element modeling (FEM) techniques. We developed a 2D axisymmetric...
To study the relation between the QFP lead-free solder stress and strain accumulation under the condition of the impact of temperature (-55??C~125??C), Visco-plastic finite element model based upon Anand constitutive equations is established to numerically analyze the interfacial stress of solder formed by three different kinds of solders to the same substrate FR-4. The results shows that the interface...
A thermal interface material (TIM) is typically a compliant material with high thermal conductivity that is applied between a heat-generating chip and a heat spreader in an electronic package. For a high-conductivity polymeric TIM, the adhesion strength between the TIM and its mating interfaces is typically weak, making the TIM susceptible to degradation when subjected to environmental stresses. At...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics industry. Future packages will have an even higher number of I/O's and pitches down to 20 microns resulting in high dissipation losses and extreme current densities. When using conventional materials, design engineers will face physical barriers and limitations in performance and new material solutions...
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package...
The objective of this paper is focused on the hygroscopic swelling effect on polymeric material used in electronic package and thermo-hygro-structure coupled design and reliability analysis for finger printer package. For moisture absorption/desorption analysis, the ambient environment for temperature and humidity are set to be 60degC60%RH, 85degC60%RH and 85degC85%RH, respectively. The transient...
The problem of a corner delamination in a fan-out chip scale package subjected to thermomechanical load is investigated. The fracture mechanics parameters, including the stress intensity factors, the strain energy release rate, and phase angles, for a quarter-circular corner delamination between silicon die and fan-out redistribution polyimide layer are obtained by using numerical finite element approach...
Drop/impact causes high strain rate deformation in solder joints of microelectronics package. It is important to understand mechanical behavior of solder joints under high strain rate for reliability design of products. In this paper mechanical behaviors of two lead-free solder alloys, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated by quasi-static tests and the split Hopkinson tension/pressure bar testing...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
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