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To study the relation between the QFP lead-free solder stress and strain accumulation under the condition of the impact of temperature (-55??C~125??C), Visco-plastic finite element model based upon Anand constitutive equations is established to numerically analyze the interfacial stress of solder formed by three different kinds of solders to the same substrate FR-4. The results shows that the interface...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
In this study, the modified panel base package (PBP) technology with enhanced cover layer is proposed to improve packaging reliability. One cover layer which has larger Young's modulus than the lamination material is applied to restrain the expansion/shrinkage of dielectric. The testing samples are fabricated and tested under temperature cycling. Besides, three-dimensional finite element (FE) analysis...
Drop/impact causes high strain rate deformation in solder joints of microelectronics package. It is important to understand mechanical behavior of solder joints under high strain rate for reliability design of products. In this paper mechanical behaviors of two lead-free solder alloys, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated by quasi-static tests and the split Hopkinson tension/pressure bar testing...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
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