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Solder joint reliability issues that can be identified only at the system level are notoriously difficult to resolve in a timely manner using trial and error experimentation alone. The particular case of solder joint reliability of a side switch in a phone subjected to drop-impact is addressed. An approach employing Response Surface Methodology (RSM) is proposed to solve reliability and robust design...
In this study, the modified panel base package (PBP) technology with enhanced cover layer is proposed to improve packaging reliability. One cover layer which has larger Young's modulus than the lamination material is applied to restrain the expansion/shrinkage of dielectric. The testing samples are fabricated and tested under temperature cycling. Besides, three-dimensional finite element (FE) analysis...
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