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Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
In order to investigate the effect of the bonding parameters on the reliability of Al heavy wire bonds, samples were bonded with three different ultrasonic power levels and three different bonding force levels. The samples were exposed to active power cycling with a temperature swing of 120K (measured at the chip center). Each wire bond??s individual temperature swing was determined by IR thermography...
Anisotropic Conductive films (ACFs) have been widely used in semiconductor and display applications for chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), chip-on-flex (COF), chip-on-board (COB) interconnections due to their green and energy saving, fine-pitch capability, simple process, and cost effectiveness. There have been many technical innovations in terms of materials and processing...
While assess the bonding quality of thin plate, it is quite difficult to extract the characteristics of echoes for analysis because of the weakening of defect echoes which were interfered by the high reflection of metal layer and noise. Target on the non-stationary and time variant characteristic of echoes, this paper propose to use the short time Fourier transformation methods to conduct these kinds...
Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and...
Due to the massive applications of multilayered composite materials (for example carbon fiber material, glass fiber material etc.) in material industry, aviation industry, medical enterprise and other consumer industries, it becomes an important work to carry on the non-destructive evaluation to the long-term characteristic and the security of the composite materials in use. The reliability of a composite...
Bonding is an essential step to enclose microchannels or microchambers in lab-on-a-chip. Ultrasonic bonding was studied as a deformation-free technique to realize high efficiency bonding of microfluidic chips. Based on viscoelastic dissipation theory, the main influential factors of heat generation rate during ultrasonic bonding was theoretically analyzed and numerically calculated using finite element...
The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is reduced. It provides foundation for design and operating of wire bonding system.
Various feature extraction methods are developed in non-destructive evaluation (NDE). Among many linear methods been proposed, the Fisher linear discriminant is a very useful technique. But as the mean square error (MSE) increased, a classifier based on Fisher criterion will reduce the efficiency. In this paper, we expand the criterion and develop a spindle-deviation minimization (SDM) method to solve...
Permanent acoustic bonding agents are important for affixing transducers to acoustic materials. They are used for electronic, industrial, medical, and research applications. An important research aspect has been the characterization of permanent and nonpermanent bonding materials. The work reported here characterizes the transfer efficiency of selected permanent bonding agents in the frequency region...
In this study, a novel anisotropic conductive film (ACF) bonding process using ultrasonic vibration was investigated in chip-on-board (COB) and flex-on-board (FOB) applications. The ACF temperature increased as the U/S power increased and the bonding pressure decreased. The ACF temperature was successfully controlled by adjusting both U/S power and bonding pressure. The optimized U/S bonding time...
Thermoelectric properties of ternary silver thallium tellurides: Ag8T12Te5 and AgT13Te2 were studied above room temperature to slightly below the melting temperature. As for Ag8T12Te5, the effects of Te content on the thermoelectric properties were also studied by characterizing the samples of Ag8T12Tex (x = 5.0, 5.1, 5.2). Both compounds show positive Seebeck coefficient (S). Ag8T12Te5 indicates...
To study the effect of double filling of the skutterudite iron antimonides on the thermal conductivity, we have synthesized dense samples of Ca1-xLaxFe4Sb12 (0 les times les 1) and Ca0.3La0.6Fe4-yCoySb12 (y = 1, 1.5) by the spark plasma sintering technique. Electron-probe microanalysis revealed that the double-filled samples with x = 0.25, 0.5, and 0.75 consist of three phases of micrometer scale;...
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