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For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
Copper wire has been popular in these years when facing ever-increasing gold prices. The success of large scale conversion of gold to copper wire in microelectronics could achieve successfully when all the failure mechanisms that can be discerned during reliability testing. One of these mechanisms is corrosion of the contact between the copper (Cu) ball and the aluminum (Al) bond pad, consisting of...
The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring...
Electronic control units (ECUs) in automotive industry are exposed to extreme harsh electrical and physical working conditions. Moreover, due to the continuous innovation in automotive industry, complexity and miniaturization of these systems are increasing. Beside the environmental factors, there are other new requirements facing the electronic components reliability in automotive industry accompanied...
Copper wire bond has been applied in industry for years and its package reliability is certainly an important subject for researchers and manufacturers. The mechanism of wire bond formation is complicated and a consensus hasn't been reached. Combination of a few theories to hypothesize the whole process of copper wire stitch bond formation on silver plating surface is elaborated in this paper. The...
This paper describes the study of a new pattern plate, direct current (DC) electrolytic copper plating chemistry for IC package (PKG) application. The new chemistry shows good via-filling performance and good pattern plate uniformity together with thinner surface copper deposit. Also it shows excellent thermal reliability and good deposit physical properties. The new chemistry delivers high quality...
The hermetic sealing of a Micro Electronic Mechanical (MEMS) system is a critical requirement to the functional operation of MEMS devices. Cu-Sn SolidLiquid Inter-diffusion (SLID) bonding is one such encapsulation method of achieving hermetic sealing of MEMS devices. Recently, studies have identified a cause for concern relating to the reliability of SLID bonding. These studies have shown that electroplated...
The Zn-Al solder alloy is a promising candidate to replace the conventional high lead solders (Pb-5Sn, Pb-10Sn) in automotive applications, which work in a harsh environment combined with thermal and mechanical loads. In this work, the effects of concurrent vibration and elevated temperature on the Zn-Al solder interconnection on Cu or Ni-P plated Cu substrates were studied. The test samples by forming...
With the rapid development of the electronic industry, electronic products tend to be small, lightweight and high density, the demand of flexible copper clad laminate (FCCL) is increasing every year. Peel strength is a key property for FCCL. This paper studies the effect of heat/humidity treatment on the adhesion strength of FCCL. The results show that the original peel strength of FCCL was high in...
In this investigation, Cu-Sn lead-free solder microbumps on 10- pads with a 20- pitch are designed and fabricated. The chip size is 5 5 mm with thousands of microbumps. A daisy-chain feature is adopted for the characterization and reliability assessment. After pattern trace formation, the microbump is fabricated on the trace by an electroplating technique. A suitable...
In this study, based on the conductive polymer filled with Ag-coated Cu dendritic powder (ACDP), Ag-coated glass fiber powder (AGFP) was selected as assistant filler to improve the conductive network. The results showed that the volume resistivity reached 0.004£2cm when the total fillers were less than 70.6 wt%. The effect of the filler content of the AGFP powder on the conductivity, creep behavior...
Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) and wet conditions (85°C in DI water with and without NaCl) in an effort to better understand the corrosion mechanisms that operate under moist and wet conditions. The objective of this work is to undertake and report on the initial stages of a research project that aims to compare the performance...
One of the main drawbacks of silver-filled isotropically conductive adhesives (ICAs) is the high cost of silver fillers, while low cost copper-filled ICAs are not reliable due to the oxidation of copper fillers. In this paper, we develop highly conductive, highly reliable, and low cost ICAs filled with silver-coated copper (Ag-coated Cu) flakes, i.e. an anhydride-cured ICA filled with Ag-coated Cu...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
Copper and gold ball bonds were bonded on 1.2 μm thick Al-0.5%Cu-1%Si. One set of devices was aged at 175°C up to 1000 hours. A second set of devices was pre-conditioned for 168 hours at 85°C and 85% relative humidity followed by ageing at 175°C up to 1000 hours. No cratering was found with either wire in as-bonded devices but devices bonded with copper developed cratering after ageing. Neck and stitch...
The η-η' transformation of interfacial Cu6Sn5 in solder joints was studied. Two cooling rates were selected to obtain different grain sizes of intermetallic compounds (IMCs). In the case of air cooling, the compounds were tiny and no η-η transformation was detected in the as-soldered state. Under furnace cooling, however, thick and coarse interfacial IMCs were obtained and η was still stable. After...
Effect of Cu substrates and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging was investigated. Solder joints with three types of Cu bonding pads (electroplated Cu, polycrystalline Cu and single-crystal Cu) and Sn-based solders (Sn-3Ag-0.5Cu and Sn-37Pb) were prepared, and subsequently the samples were aged at 150°C and 175°C, Under the same aging conditions,...
Copper (Cu) wire bonding is getting more common as interconnections on aluminium (Al) bond pad metallization in microelectronics due to lower cost compared to gold wire bonding. The Cu-Al intermetallic compounds (IMC) growth in Cu ball bonds has been investigated by many researches but the understanding of the IMC phases is still incomplete and the impact to bond reliability know-how is limited. This...
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Conventional bare Cu bonding wires, in general, are severely limited in their use compared to Au wires. A coated Cu bonding wire (EX1) has been developed for LSI application. EX1 is a Pd-coated Cu wire to enhance the bondability. Bond reliability at a Cu wire bond...
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