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In this work we demonstrate how a novel single free electron detector “Timed Photon Counter” (TiPC) may benefit from ultra-thin MgO transmission dynodes (tynodes). These membranes are fabricated through MEMS process technologies, with atomic layer deposition (ALD) as the most apt technique for growing films of good quality, with excellent control over thicknesses and extremely low surface roughness...
This paper introduces a way to increase the airgap of a capacitive MEMS sensor or actuator. Usually, a thicker sacrificial layer composed of silicon dioxide is used to increase the distance between two parallel plates. In our case, both poly-silicon planes are being produced with a small gap filled with silicon dioxide. Corrugation grooves lined with highly tensile silicon nitride cause a stress induced...
In this paper, we report on high-performance piezoelectric-on-silica micromechanical resonators for integrated timing applications. Fused silica is used as the resonator structural material for its excellent material properties, and thin film aluminum nitride is used as the piezoelectric transduction layer. A silica resonator is demonstrated with a high quality factor (QU∼25,841), low motional impedance...
In this paper, the localized surface plasmon effect of gold (Au) nanoparticles deposited on the silicon nanohole (SiNH) array textured surface is studied via simulation for better light trapping purpose for thin film silicon solar cells application. The ultimate efficiency of the optimized SiNH array textured surface is increased by 27.5% with the inclusion of Au nanoparticles on its surface. The...
This paper presents the realization of micrometer sized silicon nitride tetrahedra with well-defined angles that are folded out of a planar geometry using capillary forces. The required specific three-dimensional shape is achieved by a well-defined folding sequence. Using the favorable properties of the recently developed corner lithography technique, a programmable stop hinge is micro-machined by...
This paper reports a 3-dimensional (3D) micro-optical coupling system for improving coupling efficiency in the Littrow configured micro-electro-mechanical system (MEMS) tunable lasers. In the coupling system, an optical fiber acts as a rod lens for light convergence in the vertical plane, while a deep-etched silicon parabolic mirror confines the light in the horizontal plane. Compared with previous...
Cracks patterned lithographically into the buried oxide (BOX) layer of silicon-on-insulator wafers were found to substantially improve yield in the release of ultrasoft silicon cantilevers. The BOX layer is useful as an etch stop and sacrificial layer in microfabrication. However, compressive stress in the BOX membrane can cause it to buckle and crack when released. These cracks can damage delicate...
A novel supercritical fluid deposition method (SCFD) of SiO2 has been developed for polymer-based MEMS. In order to reduce deposition temperature for the application to polymer-based MEMS process, we selected O3 as an oxidant in SiO2-SCFD. Conformal SiO2 deposition on Si trenches (aspect ratio 24) at low temperatures (below 200°C) was achieved, which were acceptable for deposition on polymers. In...
This paper reports an electromagnetic shielded cantilever-tip microwave-probe for conductive-property imaging at micro/nano surface-area. Equipped with an ultra-sharp tip apex (<;50 nm), the probe features small conducting path resistance of Rs<;5Ω and conducting path-to ground capacitance of Ctip≈1pF. These optimal-designed parameters facilitate satisfactory spatial resolution and microwave-signal...
In this work we describe the manufacturing and characterization of patterned surfaces with large spatial contrast in wettability. We find drastic enhancement of pool boiling performance in water. In comparison to a hydrophilic SiO2 surface with a wetting angle of 7°, surfaces combining superhydrophilic and superhydrophobic patterns can quadruple the heat transfer coefficient (HTC). Superhydrophilic...
This paper describes a novel convex poly-Si structure capable of preventing a silicon-on-insulator micro-electromechanical- systems (SOI-MEMS) structure that is movable in the z-direction from sticking to a supporting substrate. This structure is referred to as a poly-Si mushroom-shaped structure (pSiMS) because the structure has a convex shape that resembles a pileus of a mushroom. A pSiMS with a...
MEMS Lamb wave ultrasonic devices have been shown to be extremely useful for applications of sensor, actuator, resonator, and so on. This paper presents the design and fabrication of Lamb wave microdevice based on ZnO piezoelectric film. The Lamb waves were respectively launched and received by both Al interdigital transducers deposited on ZnO/Al/LTO/Si3N4/Si thin piezoelectric composite plate. The...
To achieve the highest power conversion efficiency, heterogeneous chip-scale integration of silicon-based and GaN-based power switches with SiC power diodes, silicon CMOS control IC, MEMS inductor and micro microchip supercapacitor assembled using advanced packaging and microcooling is reported.
TaN was widely used as Cu diffusion barrier in CMOS Cu-BEOL technology, in which it was removed by CMP process. Some work was done on TaN etch by Br/Cl-based gas for metal gate application. But seldom work was done for TaN etch in CF-based gas. In this work TaN etching in CF4/CHF3 gas was investigated on CVD alpha-Si substrate for CMOS compatible MEMS/Sensor application. To avoid resist poisoning...
We have developed a novel fabrication process which integrates silicon MEMS actuators with silica optical components. Suspended silica optical waveguides are actuated by a silicon electrostatic comb drive actuator, with a maximum displacement of 8 μm at 35 V bias.
A type of MEMS double Si3N4 resonant beams pressure sensor is presented in this paper. The maths models are established in allusion to the Si3N4 resonant beams and pressure sensitive diaphragm. Based on the maths model of Si3N4 resonant beams, the relation between the resonant frequency and key dimension of Si3N4 resonant beams is analyzed theoretically by the vibration differential equation, at the...
Three-dimensional Li ion microbatteries are known for their high surface area which leads to high current and capacity compared to traditional planar batteries. This paper describes economical approaches to prepare half 3D microbatteries based on silicon microchannel plates (MCP). The high aspect ratio silicon MCP is formed by electrochemical etching and a nickel layer is coated onto the silicon MCP...
MEMS electron-transparent membranes made of low-stress silicon nitride are widely employed in electron microscopy. However, this material has limited resistance to electron beams. We therefore developed a layer of LPCVD SiC. Our layer is amorphous, uniform, continuous, low-stress, and has extremely low etch-rates in common wet etchants. As free-standing electron transparent window, it demonstrates...
This paper reports the design, fabrication, and testing of a multilayer cantilever structure having a doped silicon heater-thermometer separated from the silicon cantilever legs by a thermally insulating silicon nitride layer. The multilayer microcantilever can be heated above 600??C. Highly sensitive thermal topography measurements were successfully demonstrated on a 20 nm tall silicon grating. The...
A new method for releasing high aspect-ratio microstructures has been demonstrated that utilizes silicidation to form gaps between movable microstructures and their substrates in substantially faster times than conventional sacrificial layer-based release methods and with much less concern for stiction or attack of unintended layers. The key enabling element is the use of a self-sufficient chemical...
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