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On-chip EM modeling at mm-wave frequencies requires design methods that incorporate the layout and verification macros of IC EDA tools with parameterized EM CAD. We propose a novel, flexible design flow for 3D EM modeling of BEOL structures that allows for parameterized design of BEOL structures using Pcell elements as seed, thereby reducing the time required to generate the full simulation model...
With the continuous shrinking of the feature size, the effect of stress on the performance of the IC device and circuit can no longer be ignored. In fact, stress engineering is becoming more and more widely used today in advanced IC manufacture processes to improve device performance. Different from the intentionally introduced stresses to improve circuit performance, the shallow-trench-isolation...
We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new...
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