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This study describes board-level drop reliability of TFBGA subjected to JEDEC drop test condition which features an impact pulse profile with a peak acceleration of 1500G and a pulse duration of 0.5 ms. The solder ball is assumed as an elastoplastic model, and the other components are assumed to be linear elastic models. Both the global/local finite element method and the finite grid region method...
The aim of vehicular reliability experiment is assessing its reliability, measuring its reliability index and serving for vehicular design, manufacturing and development. In this paper, we present product virtual reliability analysis method, which is based on Virtual Reality and Virtual Prototype technology. It is a software platform that integrates various engineering software and simulated algorithms,...
In this study both finite element modeling and experimental techniques are employed to study the reliability of electronics components under random vibration loading conditions. A fatigue life estimation procedure, that would help analyst to make relatively accurate prediction of induced fatigue life, Finite Element model of the test vehicle is built using ANSYS software. The model is first validated...
A novel reliability qualification methodology to evaluate chip-package interaction (CPI) is presented. Experimental and finite element analysis results are combined in a new protocol that provides solutions to address the need of CPI test vehicles for pre-qualification purposes, more accurate CPI risk projection, and more flexibility for productization.
This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8??8 mm PBGA, l0??l0 mm QFN, and 51??51 mm CBGA. They are designed to consist of SAC387, SAC305, ??SAC305 ball + SAC387 paste?? and ??SAC387 ball + SAC305...
A finite element model of the suspension structure of 9000 kN self-walking transporter was established, and the distribution of stress was simulated and calculated in order to determine the position of the dangerous point. Based on the actual working conditions and the results of FEM analysis, the reliability test of the suspension structure was done. The results of test are in good agreement with...
The conversion to Pb-free solders has already been implemented in the consumer market. However, the transition to Pb-free solders in the high performance, mission critical networking/server industry has not yet been fully implemented. A significant factor in the slow transition to Pb-free solders is the absence of industry accepted Pb-free acceleration transforms that can translate lab test results...
This paper targets the reliability of electronics components, specially avionics and automotive electronic system, under random vibration conditions. A fatigue life estimation procedure is presented and each step of procedure is explained. Finite Element model of the test vehicle is built in ANSYS. The model is first validated by correlating the natural frequencies, mode shapes and transmissibility...
This work will present case studies of three types of flexible printable circuits subjected to different loading conditions in order to evaluate their technologies regarding mechanical reliability. Typical causes of failure in electronic devices are associated with mechanical stress, moisture, heat from transportation and field use. Typically manufacturers carry out tests to evaluate the reliability...
In this paper, a leading indicators based approach has been developed for prognostics and health monitoring of electronic systems. The approach focuses on the prefailure space and methodologies for quantification of damage progression and residual life in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Traditional health monitoring...
This paper focused on design, assembly and reliability assessments of 21 ?? 21 mm2 Cu/Low-K Flip Chip (65 nm technology) with 150 ??m bump pitch. Metal redistribution layer (RDL) and polymer encapsulated dicing lane (PEDL) were applied to the chip wafer to reduce the shear stress on the Cu/low-K layers and also the strain on the solder bumps. The first level interconnects evaluated were Pb-free (97...
The motion of supercavitating vehicle is complex, and the stability of supercavitating motion is an important problem. If the force of supercavitating vehicle is analyzed under the unstable motion, it is irrationality obviously. Therefore, it has more significance in engineering application that the reliability analysis of supercavitating vehicle under the steady motion. Taking this as a starting...
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