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We use a thin-film adhesion technique that enables us to precisely measure the energy required to separate adjacent layers in OPV cells. We demonstrate the presence of weak interfaces in prototypical inverted polymer solar cells, either prepared by spin, spray or slot-die coating, including flexible and non flexible solar cells. In all cases, we observed adhesive failure at P3HT:PCBM/PEDOT:PSS interface,...
Due to the requirement of high throughput, functional testing of MEMS gyroscopes should be performed on wafer level while the wafers are still on the carrier tape. In addition, it is often required that the functional characterization is carried out also at elevated temperatures, up to 150°C. The fact that comprehensive characterization of gyroscopes can take tens of minutes sets stringent requirements...
At Loughborough University an environmentally friendly manufacturing process for electronic circuits, involving the embedding of electronic components in thermoplastic resins via insert injection moulding, is under development. Once embedded, interconnection between components is achieved by subsequently plating or printing metallisation patterns on the moulding surface. The environmental benefits...
The permanent miniaturization of automotive, medical and consumer products requires alternative packaging solutions. So far most electronic products are circuit boards mounted in a separate body. An upcoming alternative are moulded interconnect devices (3D-MID). They combine the substrate function for interconnects and the housing function. To ensure a high integration density it is necessary to apply...
This paper addresses the influence of the viscoelastic material properties of adhesives on the functionality of SHM (Structural Health Monitoring) sensor applications. Adhesives behave viscoelastically and show a strong temperature and time dependency of their mechanical properties. Creep processes increase the deformation under mechanical load and relaxation can decrease the stress in the adhesives...
Ultra thin temperature responsive polymer, poly(N-isopropylacrylamide) (PIPAAm) grafted layer exhibits cell attachment and detachment properties in response to temperature change. Such properties are dependent on thickness and amount of the grafted PIPAAm, and are observed for extremely ultra thin thickness (for example, 20 nm thickness for tissue culture poly styrene and 5 nm for glass cover slips)...
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, carbon, and metal-coated polymer fillers for z-axis interconnections. A variety of conducting adhesives with particle sizes ranging from 5 nm to 15 mum were incorporated as interconnects in printed wiring board (PWB) or laminate chip carrier (LCC) substrates. Scanning electron microscopy (SEM) and optical...
In this paper we present the results of a study done to compare and contrast BCB and ALX polymers in typical WLP structures fabricated at RTI. Based on initial studies of the materials vendor, Asahi Glass Corp, AGC, we have examined the processing parameter space of ALX-211, in order to develop scalable manufacturing processes for these films. We present process flow and photo property data on ALX-211,...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
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