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By leveraging on the wealth of Si-CMOS technology know-how and the largely available infrastructures, the fundamental photonic device building blocks and circuit integration platform, essential for the realization of the electronic-photonic integrated circuit (EPIC), have been successfully developed. This presentation gives an overview on the current status of this critical technology and provides...
Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects...
We have fabricated a WDM device consisting of two or three shallow-etched AWGs on 5-inch SOI wafer. The center wavelength difference between the closely located AWGs was smaller than 1 nm. Meanwhile, the center wavelength deviation over the whole wafer was larger than 5 nm.
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