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In this study, the high dielectric constant of the polymer/ceramic composites is used to fabricate capacitive substrates. The reliability and failure analysis of the capacitive substrate under temperature and voltage stress have been studied. The mean time to failure (MTTF) of the capacitive substrate shows a voltage exponent value dependence on applied voltage with a constant of ≃3.3 as the measurement...
Electrical characterization of various capacitors and resistors on PEI and PET substrates is performed. The resistive inks with various nominal sheet resistances have been used. Capacitor was made using BaTiO3 dielectric layer. The screen printing process is used to manufacture the resistors and capacitors according to the recommendations of manufacture parameters. The effects of different resistor...
An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70mA with a switching frequency of 200MHz and a 2x2mm on-chip LC output filter in 0.35mum CMOS. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3%, and the power efficiency...
Capacitive humidity sensors were fabricated using countersunk interdigitated electrodes coated with amorphous nanostructured TiO2, SiO2, and Al2O3 thin films grown by glancing angle deposition. The capacitive response and response times for each sensor were measured. The sensor utilizing TiO2 exhibited the largest change in capacitance, increasing exponentially from ~ 1 nF to ~ 1muF for an increase...
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