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Enabling a high-density ReRAM product requires: developing a cell that meets a stringent bit error rate, BER, at low program current, integrating the cell without material damage, and providing a high-drive selector at scaled nodes. We discuss ReRAM performance under these constraints and present a 16Gb, 27nm ReRAM capable of 105 cycles with BER < 7×10−5.
A non-classical device structure namely self-aligned quasi-silicon-on-insulator (SOI) metal-oxide semiconductor (MOS) field-effect transistor with pi-shaped semiconductor conductive layer (SA-piFET) is presented, seeking to improve the performance and upgrade the reliability of the SOI-based devices. Designed to equip with a SA single crystal silicon channel layer, plus a natural source/drain (S/D)...
Current mode (CM) scheme provides suitable alternative for the high speed on-chip interconnect signaling. This paper presents a energy-delay optimization methodology for the current-mode (CM) signaling scheme. Optimization for the CM circuits for on-chip interconnects requires a joint optimization of driver and receiver device sizes, as their parameters which affect the energy-delay performance depend...
This paper presents an innovative structure based on 3 dimensional integration technology, where ultra thin inter layer dielectric enables a dynamic threshold voltage (VTH) control. A sequential process flow is proposed to fabricate 3D devices with dynamically tunable VTH. This ability can be exploited to design SRAMs cells with increased stability and surface density compared to planar technology...
Ultra Thin Body Si-On-ONO (UTB SOONO) transistors with ultra thin spacer are successfully demonstrated and evaluated. They have shown increased driving current more than 30% compared with conventional UTB SOONO transistors with thick spacer due to reduced source/drain resistance without short channel effect degradation by using thin spacer. In this paper, it is shown that thin spacer technology is...
To investigate the impact of gate oxide degradation and breakdown (BD) on complimentary metal-oxide-semiconductor circuit functionality, an accurate description of the electrical characteristics of the stressed devices, which can be included in circuit simulators, is needed. In this paper, a description of the stressed device performance that considers, on the one hand, the variation of the channel...
The next generation of wireless communication is a ubiquitous radio system concept, providing wireless access from short-range to wide-area, with one single reconfigurable and adaptive system for all envisaged radio environments. This paper presents the design approach of RCO (reconfigurable concurrent oscillator) that simultaneously generates two or more signals of different frequencies that eliminate...
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