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We have developed a thin, reliable, low-thermal-resistance LSI packaging technology by embedding a high-pin-count LSI chip into thin build-up layers supported by Cu plate. The embedded LSI chip is a microprocessor with approximately 1500 pads and a thickness of 50 μm, and it is completely laminated by the first build-up epoxy resin. The total package thickness is only 0.71 mm including a 0.5-mm-thick...
A novel integral micro-channel heat sink was developed, featuring an array of sub-millimeter channels fabricated directly in the back-metallization layer of the direct bond copper or active metal braze ceramic substrate, thus minimizing the material between the semiconductor junction and fluid and the overall junction-to-fluid thermal resistance. The ceramic substrate is bonded to a baseplate that...
This study reports a new thermal management scheme for vertical Gallium Nitride (GaN) nanowire (NW) arrays. A new cooling design for vertical NWs is developed by encapsulating NWs with electroplated copper. Numerical simulations show that the thermal performance of NW array could be significantly enhanced when encapsulated with high thermal conductivity materials. We have also developed a tip temperature...
In this paper, a new bulk silicon isolation structure with wafer-thick trenches is proposed for automotive (42 V) power-integrated-circuit applications. This technology provides the advantages of complete isolation with lower wafer cost and higher thermal-dissipation capability as compared with the silicon-on-insulator technology. Experimental results show that the new isolation structure can provide...
Heat dissipation is becoming a key issue in designing packages due to growing power densities associated with IC downscaling and the introduction of new semiconductor technologies (e.g. AlGaN). Additionally, FlipChip assembly is being favoured due to small form factor and reduced interconnect parasitics which can be essential for RF and microwave applications. Compared to chip and wire technology...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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