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This paper presents a model based junction temperature control system to increase the expected lifetime of IGBT power modules by using a hybrid discontinuous modulation technique. This modulation technique offers the possibility to influence the switching losses and is therefore used as a correcting variable for controlling the junction temperatures of IGBT power modules.
Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility to reduce the stress to semiconductors is to control the amount of losses that occur in the device during operation. This work presents an active thermal controller that aims at reducing the junction temperature variations in the case of variable power profile. The switching frequency of the converter...
Health management and reliability form a fundamental part of the design and development cycle of electronic products. In this paper compact real-time thermal models are used to predict temperatures of inaccessible locations within the power module. These models are then combined with physics of failure based reliability analysis to provide in-service predictions of crack propagation in solder layers...
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