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In order to meet the through-life reliability targets for power modules, it is critical to understand the response of typical wear-out mechanisms, for example wire-bond lifting and solder degradation, to in-service environmental and load-induced thermal cycling. Application of accurate wear-out models can identify the dominant failure mechanisms at the design stage and can be employed in reliability...
This paper presents a real-time electro-thermal simulation system which is a novel method of estimating the junction temperatures of power semiconductors. It calculates the junction temperatures of the power semiconductors in real time. The load current and the output voltage of an actual power conversion system are detected to calculate the instantaneous power loss. The detected output voltage is...
Health management and reliability form a fundamental part of the design and development cycle of electronic products. In this paper compact real-time thermal models are used to predict temperatures of inaccessible locations within the power module. These models are then combined with physics of failure based reliability analysis to provide in-service predictions of crack propagation in solder layers...
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