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The novelty of this paper is the proof of functional microdevice fabrication using a recently developed low-temperature transfer process. The process is based on adhesion control of molded Ni microstructures on a donor wafer by using plasma-deposited fluorocarbon films. Low-temperature adhesive bonding of the microstructures on the target wafer using benzocyclobutene sealing enables mechanical tearing...
The presented process technology enables the fabrication of 3D high-aspect-ratio microstructures featuring the integration of multiple materials. The technology offers the possibility to benefit from unique material properties for optimized MEMS functionality and performance. The fabrication process relies on wafer stacking by low temperature plasma activated direct bonding, SOI layer transfer and...
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