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In this study, three examples of failure analyses of electronic packaging by using the finite element method are presented. These are: (1) the failures (delaminations) near the interface between the filled copper and the silicon and between the copper and the silicon dioxide dielectric of the TSV of a 3D system-in-package (SiP) due to the local thermal expansion mismatch between the silicon and the...
In this paper, the impact from both mechanical and thermal effects, with different parameters on BPSG of a power package is studied. The impact parameters include wedge wire bonding force, clamping force from the spring clip, wave soldering process and power dissipation from the die. An advanced 3D FEA model framework with a global model and local sub-model is developed. Major modeling work includes...
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