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Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent batch reflow suitable for high-volume production. AuSn solder was selected because of its fluxless bondability, good wettability, and self-alignment process...
With the most popular electronics products being the slimmest ones with the highest functionality, the ability to thin, stack and interconnect chips is becoming more important. One method to accomplish this is by using the through silicon via (TSV). This is a means of electrical connection in 3D stacked devices that saves space and shortens the electrical interconnect length, improving electrical...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Since mechanical stress sometimes degrades both electronic functions and reliability of LSI chips, it is very important to control the residual stress in them to assure their highly reliable performance. The authors have already found that the distribution of the residual stress on a transistor formation surface of a chip changes significantly by changing the bump joint structure of packages or modules...
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