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Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are commonly used for TCB and the oxidation of these metals is limited (Au) or easily controlled (Cu). However,...
Self-assembled monolayer (SAM) films of p-aminophenyl trimethoxysilane (APhTS) and 3-mercaptopropyl trimethoxysilane (MPTS) were used to immobilize gold nanoparticles (AuNPs) on silicon substrates and silicon-based microdevices, which created robust nanoparticle coatings that reduced microstructure adhesion. The terminal groups of APhTS and MPTS have both been previously shown to strongly interact...
A series of finite element thermoelectric coupling simulations on the Ti/Pt/Cr/Au thin film microheater array were conducted. The infrared image of the fabricated microheater device confirmed the simulation results. Based on these simulations, a microheater array was fabricated on Si/SiO2 substrate, and carbon nanotube bundles were grown locally at a temperature of above 650??C while the temperatures...
This paper reports, for the first time, a new phenomenon named self-patterned electroplating used to selectively deposit a thin gold layer on vertical sidewalls of high-aspect-ratio channels. The ability to cover only vertical surfaces of three dimensional (3D) structures is a significant achievement in microsystems technology serving a wide range of applications including gas chromatography (GC)...
Aligned, multilevel micro contact printing without dedicated printing equipment is demonstrated. Miniature print engines are constructed from silicon parts using MEMS technology. The method is extended to include electrostatically driven patterning of flexible substrates.
This paper reports the first MEMS-based stationary phase coating technique for ultra-narrow single capillary (SCC) and multicapillary (MCC) microfabricated gas chromatography (muGC) columns yielding the highest separation performance reported to date. The conventional coating methods are mainly based on the solvent evaporation of a polymeric solution. These methods, which are developed for fused silica...
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